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• Mfr Part Number: AS5-12G
• Features:
• Contains 99.9% pure silver
• High-Density(contains over 88% thermally conductive filler by weight)
• Controlled Tripple-Phase Viscosity
• Not Electrically Conductive and Absolute Stability (will not separate, run, migrate, or bleed)
• Thermal Conductance: >300,000W/m2 °C (0.001 inch layer)
• Thermal Resistance: <0.0045°C-in2/Watt (0.001 inch layer)
• Average Particle Size: <0.49 microns <0.000020 inch
• Extended Temperature Limits: Peak: -50°C to >180°C Long-Term: -50°C to 130°C
• Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core